CS1630-FSZ datasheet(10/56 Pages) APEX

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CS1630/31

DS954F2

3.4 Thermal Resistance

3.5 Absolute Maximum Ratings

Characteristics conditions:

All voltages are measured with respect to GND.

Note:

Long-term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation at

the rate of 50mW/ºC for variation over temperature.

WARNING:

Operation at or beyond these limits may result in permanent damage to the device.

Normal operation is not guaranteed at these extremes.

Symbol

Parameter

Value

Unit



Junction-to-ambient Thermal Impedance

2 Layer PCB

4 Layer PCB

°C/W



Junction-to-case Thermal Impedance

2 Layer PCB

4 Layer PCB

°C/W

Symbol

Parameter

Value

Unit

VDD

IC Supply Voltage

18.5

1, 2, 5, 6, 7, 9,

10, 11, 15, 16

Analog Input Maximum Voltage

-0.5 to (VDD+0.5)

1, 2, 6, 7, 9, 10,

11,15,16

Analog Input Maximum Current

VGD

Gate Drive Output Voltage

-0.3 to (VDD+0.3)

IGD

Gate Drive Output Current

-1.0 / +0.5

5ISOURCE Current into Pin

1.1

3ICLAMP

Clamp Output Current

-PD

Total Power Dissipation

400

-TJ

Junction Temperature Operating Range

(Note 8)

-40 to +125

ºC

-TStg

Storage Temperature Range

-65 to +150

ºC

All Pins

ESD

Electrostatic Discharge Capability

Human Body Model

Charged Device Model

2000

500

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