ADE9078 datasheet(10/108 Pages) AD

10 / 108 page

Data Sheet

ADE9078

Rev. 0 | Page 9 of 107

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

VDD to GND

−0.3 V to +3.96 V

Analog Input Voltage to GND,

IAP, IAN, IBP, IBN, ICP, ICN, VAP, VAN

VBP, VBN, VCP, VCN

−1.9 V to +2 V

Reference Input Voltage to REFGND

−0.3 V to +2 V

Digital Input Voltage to GND

−0.3 V to VDD + 0.3 V

Digital Output Voltage to GND

−0.3 V to VDD + 0.3 V

Operating Temperature

Industrial Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec)1

260°C

ESD

Human Body Model2

4 kV

Machine Model3

200 V

Field Induced Charged Device Model

(FICDM) 4

1.25 kV

Analog Devices recommends that reflow profiles used in soldering RoHS

compliant devices conform to J-STD-020D.1 from JEDEC. Refer to JEDEC for

the latest revision of this standard.

Applicable standard: ANSI/ESDA/JEDEC JS-001-2014.

Applicable standard: JESD22-A115-A (ESD machine model standard of

JEDEC).

Applicable Standard JESD22-C101F (ESD FICDM standard of JEDEC).

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment.

Careful attention to PCB thermal design is required.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-40-71

27.14

3.13

°C/W

Test Condition 1: The junction to air measurement uses a 2S2P JEDEC test board

with 4 × 4 standard JEDEC vias. The junction to case measurement uses a 1S0P

JEDEC test board with 4 × 4 standard JEDEC vias. See JEDEC standard JESD51-2.

ESD CAUTION

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