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LSM9DS1 数据表(PDF) 69 Page - STMicroelectronics |
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LSM9DS1 数据表(HTML) 69 Page - STMicroelectronics |
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69 / 72 page  DocID025715 Rev 3 69/72 LSM9DS1 Package information 72 9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 9.1 Soldering information The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Leave “Pin 1 Indicator” unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com/mems. 9.2 LGA package information Figure 31. LGA (3.5x3x1 mm) 24-lead package outline |
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