| 数据搜索系统,热门电子元器件搜索 |
|
LSM9DS1 数据表(PDF) 27 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
LSM9DS1 数据表(HTML) 27 Page - STMicroelectronics |
|
27 / 72 page ![]() DocID025715 Rev 3 27/72 LSM9DS1 Application hints 72 4 Application hints Figure 15. LSM9DS1 electrical connections 4.1 External capacitors The device core is supplied through the Vdd line. Power supply decoupling capacitors (C2, C3 = 100 nF ceramic, C4 = 10 µF Al) should be placed as near as possible to the supply pin of the device (common design practice). Capacitor C1 (100 nF) should be a capacitor with low ESR value and should be placed as near as possible to the C1 pin. All voltage and ground supplies must be present at the same time to achieve proper behavior of the IC (refer to Figure 15). |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |