FXLS8964AF datasheet(85/98 Pages) NXP

85 / 98 page

NXP Semiconductors

FXLS8964AF

3-Axis Low-g Accelerometer

FXLS8964AF

All information provided in this document is subject to legal disclaimers.

Objective data sheet

Rev. 2 — 30 October 2020

85 / 98

NXP application note AN1902, "Assembly Guidelines for QFN and DFN Packages"

discusses the DFN package used by the FXLS8964AF.

14.1 Overview of soldering considerations

The information provided here is based on experiments executed on QFN devices. They

do not represent exact conditions present at a customer site. Therefore, information

herein should be used as guidance only, and process and design optimizations are

recommended to develop an application specific solution. It should be noted that with

the proper PCB footprint and solder stencil designs, the package will self-align during the

solder reflow process.

14.2 Halogen content

This package is designed to be Halogen Free, exceeding most industry and customer

standards. Halogen Free means that no homogeneous material within the assembly

package shall contain chlorine (Cl) in excess of 700 ppm or 0.07 % weight/weight or

bromine (Br) in excess of 900 ppm or 0.09 % weight/weight.

14.3 PCB mounting recommendations

• No additional via, copper layer, solder mask, metal pattern underneath package on the

mounted layer of the PCB.

• Do not place any components or vias within 2 mm of the package land area. This may

cause additional package stress if it is too close to the package land area.

• Signal traces connected to pads should be as symmetric as possible. Put dummy

traces on NC pads, to have the same length of exposed trace for all pads.

• Use a standard pick-and-place process and equipment. Do not use a hand soldering

process.

• Customers are advised to be cautious about the proximity of screw-down holes to the

sensor, and the location of any press fit to the assembled PCB when in an enclosure.

It is important that the assembled PCB remain flat after assembly to keep electronic

operation of the device optimal.

• The PCB should be rated for the multiple lead-free reflow condition with a maximum

260 °C temperature.

• NXP sensors are compliant with Restrictions on Hazardous Substances (RoHS),

having halide-free molding compound (green) and lead-free terminations. These

terminations are compatible with tin-lead (Sn-Pb) as well as tin-silver-copper (Sn-Ag-

Cu) solder paste soldering processes. Reflow profiles applicable to those processes

can be used successfully for soldering the devices.

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