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FXLS8964AF 数据表(PDF) 90 Page - NXP Semiconductors |
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FXLS8964AF 数据表(HTML) 90 Page - NXP Semiconductors |
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90 / 98 page ![]() NXP Semiconductors FXLS8964AF 3-Axis Low-g Accelerometer FXLS8964AF All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved. Objective data sheet Rev. 2 — 30 October 2020 90 / 98 15.2 Lead dimension detail The width of lead end as viewed from leaded side of package has minimum dimension of 0.125 mm. The maximum dimension is equal to lead width at the bottom surface of the package as indicated on the drawing. Figure 29. Bottom and leaded view dimensions 15.3 Burr specification The assembly site specifies burrs to 0.076 mm maximum. |
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