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PCF8536AT 数据表(PDF) 90 Page - NXP Semiconductors |
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PCF8536AT 数据表(HTML) 90 Page - NXP Semiconductors |
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90 / 103 page ![]() PCA8530 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2 — 25 September 2014 90 of 103 NXP Semiconductors PCA8530 Automotive 102 x 4 Chip-On-Glass LCD segment driver [1] Pressure of diamond head: 10 g to 50 g. 18. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent standards. Table 55. Alignment marking All x/y coordinates represent the position of the REF point (see Figure 60) with respect to the center (x/y = 0) of the chip; see Figure 59. Symbol Size ( m) X ( m) Y ( m) S1 90 90 2375 15 C1 90 90 2312 15 Table 56. Gold bump hardness Type number Min Max Unit[1] PCA8530DUG/DA 60 120 HV |
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