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PCF8536AT 数据表(PDF) 99 Page - NXP Semiconductors

部件名 PCF8536AT
功能描述  Automotive 102 x 4 Chip-On-Glass LCD segment driver
PDF  103 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors

PCF8536AT 数据表(HTML) 99 Page - NXP Semiconductors

Back Button PCF8536AT Datasheet HTML 95Page - NXP Semiconductors PCF8536AT Datasheet HTML 96Page - NXP Semiconductors PCF8536AT Datasheet HTML 97Page - NXP Semiconductors PCF8536AT Datasheet HTML 98Page - NXP Semiconductors PCF8536AT Datasheet HTML 99Page - NXP Semiconductors PCF8536AT Datasheet HTML 100Page - NXP Semiconductors PCF8536AT Datasheet HTML 101Page - NXP Semiconductors PCF8536AT Datasheet HTML 102Page - NXP Semiconductors PCF8536AT Datasheet HTML 103Page - NXP Semiconductors  
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PCA8530
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 25 September 2014
99 of 103
NXP Semiconductors
PCA8530
Automotive 102 x 4 Chip-On-Glass LCD segment driver
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Bare die — All die are tested on compliance with their related technical
specifications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
24.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP Semiconductors N.V.
25. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com



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