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STM32F405 数据表(PDF) 164 Page - STMicroelectronics |
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STM32F405 数据表(HTML) 164 Page - STMicroelectronics |
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164 / 204 page  Package information STM32F405xx, STM32F407xx 164/203 DS8626 Rev 9 6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 6.1 WLCSP90 package information Figure 75. WLCSP90 - 4.223 x 3.969 mm, 0.400 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. A0JW_ME_V4 SIDE VIEW Detail A A1 Detail A (Rotated 90°) eee D Seating plane A2 A b E e e1 e G e2 A3 A1 ball location BOTTOM VIEW BUMP SIDE FRONT VIEW TOP VIEW WAFER BACK SIDE bbb Z 10 1 J A F ccc ddd Z ZX Y Z Bump A1 orientation reference aaa (4X) |
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