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STM32F405 数据表(PDF) 165 Page - STMicroelectronics |
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STM32F405 数据表(HTML) 165 Page - STMicroelectronics |
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165 / 204 page ![]() DS8626 Rev 9 165/203 STM32F405xx, STM32F407xx Package information Figure 76. WLCSP90 - 4.223 x 3.969 mm, 0.400 mm pitch wafer level chip scale recommended footprint Table 90. WLCSP90 - 4.223 x 3.969 mm, 0.400 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.540 0.570 0.600 0.0213 0.0224 0.0236 A1 - 0.190 - - 0.0075 - A2 - 0.380 - - 0.0150 - A3(2) 2. Back side coating. - 0.025 - - 0.0010 - b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.240 0.270 0.300 0.0094 0.0106 0.0118 D 4.188 4.223 4.258 0.1649 0.1663 0.1676 E 3.934 3.969 4.004 0.1549 0.1563 0.1576 e - 0.400 - - 0.0157 - e1 - 3.600 - - 0.1417 - e2 - 3.200 - - 0.1260 - F - 0.3115 - - 0.0123 - G - 0.3845 - - 0.0151 - aaa - 0.100 - - 0.0039 - bbb - 0.100 - - 0.0039 - ccc - 0.100 - - 0.0039 - ddd - 0.050 - - 0.0020 - eee - 0.050 - - 0.0020 - MS18965V2 Dsm Dpad |
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