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STM32F405 数据表(PDF) 166 Page - STMicroelectronics |
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STM32F405 数据表(HTML) 166 Page - STMicroelectronics |
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166 / 204 page  Package information STM32F405xx, STM32F407xx 166/203 DS8626 Rev 9 Device marking for WLCSP90 The following figure gives an example of topside marking and ball A1 position identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below. Figure 77. WLCSP90 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering Samples to run qualification activity. Table 91. WLCSP90 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed MSv36120V1 Ball A1 indentifer Product identification(1) F405OEB R Revision code Date code YWW |
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