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L9963E 数据表(PDF) 168 Page - STMicroelectronics |
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L9963E 数据表(HTML) 168 Page - STMicroelectronics |
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168 / 184 page  7 Recommended soldering profile The soldering profile in Figure 58 is compliant to JEDEC J-STD-020 standard. It is recommended to follow these indications in order to achieve the best performances in terms of accuracy and reliability. Table 88. Reflow soldering profile according to JEDEC J-STD-020 Item Description Reflow category Reflow Condition Sn-Pb eutectic assembly Package Type Thickness < 2.5 mm and volume < 350 mm3 Preheat Minimum temperature Tsmin = 100 °C Maximum temperature Tsmax = 150 °C Duration ts = 60-120 s Liquidus phase Liquidus Temperature TL = 183 °C Average ramp-up rate (from TL to Tp) 3°C/s max Peak Temperature Tp = 240 °C Peak Duration tp = 10-30 s Ramp-down Ramp-down rate (from Tp to TL) 6°C/s max. Ramp-down duration (Tp to 25 °C) 6 min. max. Note: all temperatures are referred to the package top case. Figure 58. Recommended soldering profile L9963E Top Case L9963E Bottom PCB Side Top Heater Bottom Heater L9963E Recommended soldering profile DS13636 - Rev 12 page 168/184 |
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