ANT-2.4-CW-RCL-RPS datasheet(18/73 Pages) MICROCHIP

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WINCS02IC and WINCS02 Family

Device Overview

Data Sheet

DS70005577B - 18

Figure 2-10. WINCS02 Module Placement

Related Links

WINCS02 Module Routing Guidelines

WINCS02 Module Packaging Information

2.5

WINCS02 Module Routing Guidelines

• Use the multi-layer host board for routing signals on the inner layer and the bottom layer.

• The top layer (underneath the module) of the host board must be ground with as many GND vias

as possible as shown in the following figure.

• Avoid fan-out of the signals under the module or antenna area. Use a via to fan-out signals to the

edge of the WINCS02 Module.

• For a better GND connection to the WINCS02 Module, solder the exposed GND pads of the

WINCS02 Module on the host board.

• For the module GND pad, use a GND via of a minimum 10 mil (hole diameter) for good ground to

all the layers and thermal conduction path.

• Having a series resistor on the host board for all reserved pins and digital interface pins is

recommended. These resistors must be placed close to the WINCS02 Module.

• The RTCC Oscillator (32.768 kHz) on the host board must be placed close to the WINCS02 Module

and follow the shortest trace routing length with no vias (see the following figure).

ANT-2.4-CW-RCL-RPS 数据表(PDF) 18 Page - Microchip Technology