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ANT-2.4-CW-RCL-RPS 数据表(PDF) 56 Page - Microchip Technology |
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ANT-2.4-CW-RCL-RPS 数据表(HTML) 56 Page - Microchip Technology |
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56 / 73 page ![]() WINCS02IC and WINCS02 Family Packaging Information Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 56 RECOMMENDED LAND PATTERN Dimension Limits Units C2 Center Pad Width Contact Pad Spacing Center Pad Length Contact Pitch Y2 X2 5.40 5.40 MILLIMETERS 0.50 BSC MIN E MAX 6.90 Contact Pad Length (X48) Contact Pad Width (X48) Y1 X1 0.85 0.30 NOM C1 Contact Pad Spacing 6.90 Contact Pad to Contact Pad (X44) G2 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2021 Microchip Technology Inc. Contact Pad to Center Pad (X48) G1 0.33 C1 C2 EV EV X2 Y2 E X1 Y1 G1 G2 ØV SILK SCREEN 48-Lead Very Thin Plastic Quad Flat, No Lead Package (ZZX) - 7x7 mm Body [VQFN] With 5.3 mm Exposed Pad Microchip Technology Drawing C04-2535 Rev A |
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