WINCS02IC and WINCS02 Family

 Data Sheet

© 2024-2025 Microchip Technology Inc. and its subsidiaries

DS70005577B - 4

Table of Contents

Introduction...........................................................................................................................................................................1

WINCS02IC and WINCS02 Module Features......................................................................................................................1

1. Ordering Information................................................................................................................................................... 5

1.1. WINCS02IC Ordering Information....................................................................................................................5

1.2. Module Ordering Information..........................................................................................................................6

2. Device Overview............................................................................................................................................................ 7

2.1. Pin Details of WINCS02IC.................................................................................................................................. 8

2.2. Pin Details of WINCS02 Module..................................................................................................................... 11

2.3. Basic Connection Requirement......................................................................................................................14

2.4. WINCS02 Module Placement Guidelines...................................................................................................... 16

2.5. WINCS02 Module Routing Guidelines........................................................................................................... 18

2.6. WINCS02 Module RF Considerations.............................................................................................................19

2.7. WINCS02 Module Antenna Considerations.................................................................................................. 19

2.8. WINCS02 Module Reflow Profile Information.............................................................................................. 27

2.9. WINCS02 Module Assembly Considerations................................................................................................ 27

3. Electrical Specifications.............................................................................................................................................. 29

3.1. WINCS02IC Electrical Specifications...............................................................................................................29

3.2. WINCS02 Module Electrical Specifications....................................................................................................43

4. Packaging Information............................................................................................................................................... 53

4.1. WINCS02IC Packaging Information................................................................................................................53

4.2. WINCS02 Module Packaging Information.....................................................................................................57

5. Appendix A: Regulatory Approval............................................................................................................................. 61

5.1. United States.................................................................................................................................................... 62

5.2. Canada.............................................................................................................................................................. 63

5.3. Europe...............................................................................................................................................................65

5.4. Japan..................................................................................................................................................................66

5.5. Korea................................................................................................................................................................. 67

5.6. Taiwan............................................................................................................................................................... 67

5.7. UKCA (UK Conformity Assessed)....................................................................................................................68

5.8. Other Regulatory Information........................................................................................................................69

6. Appendix B: Acronyms and Abbreviations...............................................................................................................70

7. Document Revision History....................................................................................................................................... 72

Microchip Information....................................................................................................................................................... 73

Trademarks..................................................................................................................................................................73

Legal Notice..................................................................................................................................................................73

Microchip Devices Code Protection Feature............................................................................................................73