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ANT-2.4-CW-RCL-RPS 数据表(PDF) 55 Page - Microchip Technology |
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ANT-2.4-CW-RCL-RPS 数据表(HTML) 55 Page - Microchip Technology |
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55 / 73 page ![]() WINCS02IC and WINCS02 Family Packaging Information Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 55 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2021 Microchip Technology Inc. REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. 2. 3. Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Sheet 2 of 2 Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b E2 A3 e L E N 0.50 BSC 0.203 REF 0.30 0.20 0.80 0.00 0.25 0.40 0.85 0.035 MILLIMETERS MIN NOM 48 0.50 0.30 0.90 0.05 MAX K 0.45 REF Terminal-to-Exposed-Pad Overall Length Exposed Pad Length D D2 5.20 7.00 BSC 5.30 5.40 5.20 7.00 BSC 5.30 5.40 48-Lead Very Thin Plastic Quad Flat, No Lead Package (ZZX) - 7x7 mm Body [VQFN] With 5.3 mm Exposed Pad Microchip Technology Drawing C04-535 Rev A |
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