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ANT-2.4-CW-RCL-RPS 数据表(PDF) 19 Page - Microchip Technology |
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ANT-2.4-CW-RCL-RPS 数据表(HTML) 19 Page - Microchip Technology |
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19 / 73 page ![]() WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 19 Figure 2-11. Example of WINCS02 Module Placement on Host Board (Top Layer) Host Board Outline Module Outline Copper Keepout Copper Keepout Module Footprint Exposed GND Pad Underneath Module GND Plane on Host Board RTCC Oscillator Placement 2.6 WINCS02 Module RF Considerations The overall performance of the system is significantly affected by the product design, environment and application. The product designer must ensure system-level shielding (if required) and verify the performance of the product features and applications. Consider the following guidelines for optimal RF performance: • The WINCS02 Module must be positioned in a noise-free RF environment and must be kept far away from high-frequency clock signals and any other sources of RF energy. • The antenna must not be shielded by any metal objects. • The power supply must be clean and noise-free. • Make sure that the width of the traces routed to GND, VDD rails are sufficiently large for handling peak TX current consumption. Note: The WINCS02 Module includes RF shielding on top of the board as a standard feature. 2.7 WINCS02 Module Antenna Considerations 2.7.1 PCB Antenna For the WINCS02PE/PC Module, the PCB antenna is fabricated on the top copper layer. The layers below the antenna do not have copper trace. It is recommended that the module to be mounted on the edge of the host board and to have no PCB material below the antenna structure of the module and no copper traces or planes on the host board in that area. The following table lists the technical specification of the PCB antenna when tested with the WINCS02 Module mounted on the WINCS02 Add-On Board. |
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