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ANT-2.4-CW-RCL-RPS 数据表(PDF) 29 Page - Microchip Technology

部件名 ANT-2.4-CW-RCL-RPS
功能描述  low power consuming IC containing a 2.4 GHz IEEE 802.11b/g/n-compliant radio
PDF  73 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

ANT-2.4-CW-RCL-RPS 数据表(HTML) 29 Page - Microchip Technology

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WINCS02IC and WINCS02 Family
Electrical Specifications
 Data Sheet
© 2024-2025 Microchip Technology Inc. and its subsidiaries
DS70005577B - 29
3.
Electrical Specifications
This chapter provides the electrical specifications and the characteristics of the WINCS02IC and the
WINCS02 Module across the operating temperature range of the product.
3.1
WINCS02IC Electrical Specifications
This chapter provides the electrical specifications and the characteristics of the WINCS02IC.
3.1.1
WINCS02IC Absolute Maximum Ratings
The following table provides details about the list of absolute maximum ratings for the WINCS02IC
device. Exposure to these maximum rating conditions for extended periods can affect device
reliability. Functional operation of the device at these or any other conditions above the parameters
indicated in the operation listings of this specification is not implied.
Table 3-1. Absolute Maximum Ratings
Parameter
Value
Ambient temperature under bias(1,2)
-40°C to +105°C
Storage temperature
-65°C to +150°C
Voltage on VDD with respect to GND
-0.3V to +4.0V
Voltage on any pin(s), with respect to GND(3)
-0.3V to (VDD+0.3V)
Voltage on any pin, with respect to GND
-0.3V to (VDDIO+0.3V)
Maximum current out of GND pins
300 mA
Maximum current into VDD pins(2)
300 mA
Maximum output current sourced/sunk by any I/O pin
25 mA
Maximum current sunk by all ports
150 mA
Maximum current sourced by all ports(2)
150 mA
ESD Qualification
Human Body Model (HBM) per JESD22-A114
±2000V
Charged Device Model (CDM) (ANSI/ESD STM 5.3.1) (All pins / Corner pins)
±500V
Notes: 
1. The preceding table provides the list of stresses that can cause permanent damage to the device. This is a stress rating
only and functional operation of the device at those or any other conditions above those indicated in the operation
listings of this specification is not implied.
2. Maximum allowable current is a function of the device's maximum power dissipation.
3.1.2
Thermal Specifications
Table 3-2. Thermal Operating Conditions
Rating
Symbol
Min.
Typ
Max.
Unit
Industrial Temperature Devices:
Operating ambient temperature range
TA
-40
+85
°C
Operating junction temperature range
TJ
-40
+125
°C
V-Temp Temperature Devices:
Operating ambient temperature range
TA
-40
+105
°C
Operating junction temperature range(1)
TJ
-40
+125
°C
Power Dissipation:
Internal chip power dissipation:
PINT = (VDDIOx x (IDD –∑ IOH)) + (VDD x IDD)
PD
PINT + PI/O
W
Maximum allowed power dissipation
PDMAX
(TJ – TA)/ϴJA
W



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