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ANT-2.4-CW-RCL-RPS 数据表(PDF) 29 Page - Microchip Technology |
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ANT-2.4-CW-RCL-RPS 数据表(HTML) 29 Page - Microchip Technology |
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29 / 73 page ![]() WINCS02IC and WINCS02 Family Electrical Specifications Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 29 3. Electrical Specifications This chapter provides the electrical specifications and the characteristics of the WINCS02IC and the WINCS02 Module across the operating temperature range of the product. 3.1 WINCS02IC Electrical Specifications This chapter provides the electrical specifications and the characteristics of the WINCS02IC. 3.1.1 WINCS02IC Absolute Maximum Ratings The following table provides details about the list of absolute maximum ratings for the WINCS02IC device. Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Table 3-1. Absolute Maximum Ratings Parameter Value Ambient temperature under bias(1,2) -40°C to +105°C Storage temperature -65°C to +150°C Voltage on VDD with respect to GND -0.3V to +4.0V Voltage on any pin(s), with respect to GND(3) -0.3V to (VDD+0.3V) Voltage on any pin, with respect to GND -0.3V to (VDDIO+0.3V) Maximum current out of GND pins 300 mA Maximum current into VDD pins(2) 300 mA Maximum output current sourced/sunk by any I/O pin 25 mA Maximum current sunk by all ports 150 mA Maximum current sourced by all ports(2) 150 mA ESD Qualification Human Body Model (HBM) per JESD22-A114 ±2000V Charged Device Model (CDM) (ANSI/ESD STM 5.3.1) (All pins / Corner pins) ±500V Notes: 1. The preceding table provides the list of stresses that can cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. 2. Maximum allowable current is a function of the device's maximum power dissipation. 3.1.2 Thermal Specifications Table 3-2. Thermal Operating Conditions Rating Symbol Min. Typ Max. Unit Industrial Temperature Devices: Operating ambient temperature range TA -40 — +85 °C Operating junction temperature range TJ -40 — +125 °C V-Temp Temperature Devices: Operating ambient temperature range TA -40 — +105 °C Operating junction temperature range(1) TJ -40 — +125 °C Power Dissipation: Internal chip power dissipation: PINT = (VDDIOx x (IDD –∑ IOH)) + (VDD x IDD) PD PINT + PI/O W Maximum allowed power dissipation PDMAX (TJ – TA)/ϴJA W |
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