MPC8536EBVTATH datasheet(112/128 Pages) FREESCALE

部件名	MPC8536EBVTATH

功能描述	PowerQUICC??III Integrated Processor Hardware Specifications

PDF	128 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

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112 / 128 page

MPC8536E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2

Thermal

Freescale Semiconductor

112

Figure 72. System Level Thermal Model for MPC8536E (Not to Scale)

The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer for flow over the part

in standard JEDEC environments, as well as the heat spreading in the board under the package. In a real system, however, the

part will require a heat sink to be mounted on it. In this case, the predominant heat flow path will be from the die to the heat

sink. Grid density lower than currently in the package library file will suffice for these simulations. The user will need to

determine the optimal grid for their specific case.

Solder and Air (29

× 29 × 0.5 mm)

0.034

W/m•K

0.034

12.1

Table 80. MPC8536E Thermal Model (continued)

Conductivity

Value

Units

Substrate

Die

Bump/underfill

Section A-A

Solder/air

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MPC8536EBVTATH 数据表(PDF) 112 Page - Freescale Semiconductor, Inc