SPC560P60L3 datasheet(55/104 Pages) STMICROELECTRONICS

55 / 104 page

SPC56xP54x, SPC56xP60x

Electrical characteristics

Doc ID 18340 Rev 3

55/104

Figure 8.

Independent ADC supply

3.5

Thermal characteristics

5.5V

3.0V

VDD_HV_REG

3.0V

5.5V

VDD_HV_AD

Table 12.

Thermal characteristics for 144-pin LQFP

Symbol

Parameter

Conditions

Typical value

Unit

RJA

Thermal resistance junction-to-ambient,

natural convection(1)

Single layer board—1s

53.4

°C/W

Four layer board—2s2p

43.9

°C/W

RJB

Thermal resistance junction-to-board(2)

Four layer board—2s2p

29.6

°C/W

RJCtop

Thermal resistance junction-to-case (top)(3)

Single layer board—1s

9.3

°C/W



Junction-to-board, natural convection(4)

Operating conditions

29.8

°C/W



Junction-to-case, natural convection(5)

Operating conditions

1.3

°C/W

Junction-to-ambient thermal resistance determined per JEDEC JESD51-7. Thermal test board meets JEDEC specification

for this package.

Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for

the specified package.

Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is

used for the case temperature. Reported value includes the thermal resistance of the interface layer.

Thermal characterization parameter indicating the temperature difference between the board and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JB.

Thermal characterization parameter indicating the temperature difference between the case and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JC.

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