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S12OSCV2D 数据表(PDF) 91 Page - Freescale Semiconductor, Inc

部件名 S12OSCV2D
功能描述  MC9S12DJ64 Device User GUide V01.17
PDF  126 Pages
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制造商  FREESCALE [Freescale Semiconductor, Inc]
网页  http://www.freescale.com
标志 FREESCALE - Freescale Semiconductor, Inc

S12OSCV2D 数据表(HTML) 91 Page - Freescale Semiconductor, Inc

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MC9S12DJ64 Device User Guide — V01.17
91
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
Table A-5 Thermal Package Characteristics1
NOTES:
1. The values for thermal resistance are achieved by package simulations
Num C
Rating
Symbol
Min
Typ
Max
Unit
1T Thermal Resistance LQFP112, single sided PCB2
2. PC Board according to EIA/JEDEC Standard 51-3
θ
JA
––
54
oC/W
2T
Thermal Resistance LQFP112, double sided PCB
with 2 internal planes3
3. PC Board according to EIA/JEDEC Standard 51-7
θ
JA
––
41
oC/W
3
T Junction to Board LQFP112
θ
JB
––
31
oC/W
4
T Junction to Case LQFP112
θ
JC
––
11
oC/W
5
T Junction to Package Top LQFP112
Ψ
JT
––2
oC/W
6
T Thermal Resistance QFP 80, single sided PCB
θ
JA
––
51
oC/W
7T
Thermal Resistance QFP 80, double sided PCB with
2 internal planes
θ
JA
––
41
oC/W
8
T Junction to Board QFP80
θ
JB
––
27
oC/W
9
T Junction to Case QFP80
θ
JC
––
14
oC/W
10
T Junction to Package Top QFP80
Ψ
JT
––3
oC/W



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