STM32F217VG datasheet(164/175 Pages) STMICROELECTRONICS

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Revision history

STM32F21xxx

164/175

DocID17050 Rev 9

22-Apr-2011

Changed datasheet status to “Full Datasheet”.

APB1 frequency changed form 36 MHz to 30 MHz.

Introduced concept of SRAM1 and SRAM2.

LQFP176 now in production.

Removed WLCSP64+2 package.

Updated Figure 3: Compatible board design between STM32F10xx

and STM32F2xx for LQFP144 package and Figure 2: Compatible

board design between STM32F10xx and STM32F2xx for LQFP100

package.

Added camera interface for STM32F217Vx devices in Table 2:

STM32F215xx and STM32F217xx: features and peripheral counts.

Removed 16 MHz internal RC oscillator accuracy in Section 3.12:

Clocks and startup.

Updated Section 3.16: Voltage regulator.

Modified I2

S sampling frequency range in Section 3.12: Clocks and

startup, Section 3.24: Inter-integrated sound (I2S), and Section 3.30:

Audio PLL (PLLI2S).

Updated Section 3.17: Real-time clock (RTC), backup SRAM and

backup registers and description of TIM2 and TIM5 in Section 3.20.2:

General-purpose timers (TIMx).

Modified maximum baud rate (oversampling by 16) for USART1 in

Table 5: USART feature comparison.

Updated note related to RFU pin below Figure 10: STM32F21x

LQFP100 pinout, Figure 11: STM32F21x LQFP144 pinout, Figure 12:

STM32F21x LQFP176 pinout, Figure 13: STM32F21x UFBGA176

ballout, and Table 7: STM32F21x pin and ball definitions.

Added RTC_50Hz as PB15 alternate function, and TT (3.6 V tolerant

I/O) in Table 7: STM32F21x pin and ball definitions and Table 9:

Alternate function mapping.

PA15 added in Table 7: STM32F21x pin and ball definitions.

In Table 7: STM32F21x pin and ball definitions, changed I2S2_CK and

I2S3_CK to I2S2_SCK and I2S3_SCK, respectively.

Removed ETH _RMII_TX_CLK for PC3/AF11 in Table 9: Alternate

function mapping.

Updated Table 10: Voltage characteristics and Table 11: Current

characteristics.

TSTG updated to –65 to +150 in Table 12: Thermal characteristics.

Added CEXT and ESR in Table 13: General operating conditions as

well as Section 6.3.2: VCAP1/VCAP2 external capacitor.

Modified Note 3 in Table 14: Limitations depending on the operating

power supply range.

Updated Table 16: Operating conditions at power-up / power-down

(regulator ON), and Table 17: Operating conditions at power-up /

power-down (regulator OFF).

Updated notes below and added OSC_OUT pin in Figure 15: Pin

loading conditions. and Figure 16: Pin input voltage.

Updated VPVD, VBOR1, VBOR2, VBOR3, TRSTTEMPO typical value, and

IRUSH, added ERUSH and Note 2 in Table 18: Embedded reset and

power control block characteristics.

Table 93. Document revision history (continued)

Date

Revision

Changes

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