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STM32F217VG 数据表(PDF) 174 Page - STMicroelectronics |
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STM32F217VG 数据表(HTML) 174 Page - STMicroelectronics |
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174 / 175 page  Revision history STM32F21xxx 174/175 DocID17050 Rev 9 04-Nov-2013 9 Updated Figure 74: LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package outline and Table 86: LQFP64 – 10 x 10 mm 64 pin low- profile quad flat package mechanical data. Updated Figure 76: LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline, Figure 78: LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package outline, Figure 80: LQFP176 - Low profile quad flat package 24 × 24 × 1.4 mm, package outline. Updated Figure 82: UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm, package outline and Figure 82: UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm, package outline. Removed Appendix A Application block diagrams. Table 93. Document revision history (continued) Date Revision Changes |
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