MAS281

55/55

Module Iteration

S

R

Q

Radiation Hard Processing

100 kRads (Si) Guaranteed

300 kRads (Si) Guaranteed

Radiation Tolerance

C

F

L

Ceramic DIL (Solder Seal)

Flatpack (Solder Seal)

Leadless Chip Carrier

Package Type

Test and QCI Process

(See Section 9 Parts 3 and 4)

Assembly Process

(See Section 9 Part 2)

xMAx281xxxxx-xxxxx

Unique Circuit Designator

20

25

20MHz

25MHz

Speed Grading

Manufacturing Code of

component ic's

For details of reliability, QA/QC, test and assembly

options, see ‘Manufacturing Capability and Quality

Assurance Standards’ Section 9.

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These offices are supported by Representatives and Distributors in many countries world-wide.

© Dynex Semiconductor 2000 Publication No. DS3563-5 Issue No. 5.0 January 2000

TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

HEADQUARTERS OPERATIONS

DYNEX SEMICONDUCTOR LTD

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Lincolnshire. LN6 3LF. United Kingdom.

Tel: 00-44-(0)1522-500500

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Fax: 613.723.1518

Toll Free: 1.888.33.DYNEX (39639)

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Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-

Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.

Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.

Advance Information: The product design is complete and final characterisation for volume production is well in hand.

No Annotation: The product parameters are fixed and the product is available to datasheet specification.