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MAS281 数据表(PDF) 6 Page - Dynex Semiconductor |
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MAS281 数据表(HTML) 6 Page - Dynex Semiconductor |
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6 / 55 page ![]() MAS281 6/55 2.2 PIN FUNCTIONS A description of each pin function follows. The function name is presented first, followed by its acronym and description. Function type is either input, output, high impedance (Hi-Z), or a combination thereof. Full timing characteristics of each of the functions are shown in section 6.0. 2.2.1 POWER AND GROUND (VDD & GND) The MAS281 utilizes a single VDD power supply. A singlepoint ground is provided for the three chips on the substrate and is brought out on two module pins. 2.2.2 OSCILLATOR (OSC) This input clocks the EU state sequencer which, in turn, generates timing and control signals for the rest of the module. To minimize skew between OSC edges and signals derived from OSC, and thereby optimize system performance, the OSC rise and fall times should be minimised. It is recommended that a clock driver with a high drive capability, such as a 54AS244, 54ALS244 or 54HST244, be used. 2.2.3 SYNCHRONIZATION CLOCK (SYNC) This active low output transitions from high to low to signal the start of a new machine cycle. It should be used as a timing reference for those operations which must be synchronized to the basic machine cycle. SYNCN cycles associated with external memory or l/O bus transactions are a minimum of five OSC periods in duration and may be extended by inserting wait states via the external ready interface, For such cycles, a SYNCN low indicates that either an address or XlO command is on the AD bus; a high indicates data is on the bus. Wait states extend the high state of SYNCN. SYNCN cycles associated with internal CPU operations, are either five or six OSC periods in duration. Six OSC periods are required for machine cycles associated with microcode branches or with the execution of internally decoded XlO commands. Five OSC periods are required for all other internal operations. [Note: For modules operating at high OSC frequencies, the internal ready logic provided on the IU may cause a wait state to be inserted during execution of internal XlO commands. This would result in a SYNCN cycle of seven OSC periods duration. Though unlikely, this condition must be taken into account in implementing an external ready interface. Refer to the description of the Ready (RDYN) signal below for further details.] SYNCN continues to cycle during DMA and HOLD states. Such cycles are five OSC periods in duration. 2.2.4 ADDRESS STROBE (AS) Output/Hi-Z. This active high signal indicates that an address has been placed on the AD bus. This address is guaranteed valid at the high to low transition of AS. AS should be used to strobe an address latch during AD bus demultiplexing. This latch should be a transparent type for optimum performance. AS is placed in the high impedance state during DMA and Hold cycles and is held low during internal (non-XIO) operations. 2.2.5 DATA STROBE (DS) Output/Hi-Z. This active low signal indicates that the AD bus is being used for data transfers. During read operations, DSN should be used by the selected external device to enable data onto the AD bus. This data is guaranteed valid on the low to high transition of DSN. The selected external device should use the low to high edge of DSN to perform the write. DSN is placed in the high impedance state during DMA and Hold cycles and is held high during internal (nonXlO) operations. 2.2.6 READ/WRITE (RD/W) Output/Hi-Z, This dual function signal indicates the direction of data flow on the AD bus. A high level indicates a read operation with data being input to the module. A low level indicates a write operation with data being output by the module. RD/WN may be combined with DSN to generate separate read and write strobes. This signal goes valid shortly Figure 4: Pin Assignments AD11 |
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