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LSM303D 数据表(PDF) 19 Page - STMicroelectronics

部件名 LSM303D
功能描述  Embedded temperature sensor
PDF  52 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

LSM303D 数据表(HTML) 19 Page - STMicroelectronics

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LSM303D
Application hints
52
5
Application hints
Figure 5. LSM303D electrical connections
5.1
External capacitors
The C1 and C2 external capacitors should be low SR value ceramic type construction (typ.
recommended value 200 m
). Reservoir capacitor C1 is nominally 4.7 μF in capacitance,
with the set/reset capacitor C2 nominally 0.22 μF in capacitance.
The device core is supplied through the Vdd line. Power supply decoupling capacitors
(C4 = 100 nF ceramic, C3 = 10 μF Al) should be placed as near as possible to the supply pin
of the device (common design practice). All the voltage and ground supplies must be
present at the same time to have proper behavior of the IC (refer to Figure 5).
The functionality of the device and the measured acceleration/magnetic field data is
selectable and accessible through the I2C/SPI interfaces.
The functions, the threshold and the timing of the two interrupt pins (INT 1 and INT 2) can be
completely programmed by the user through the I2C/SPI interfaces.
5.2
Pull-up resistors
If an I2C interface is used, pull-up resistors (recommended value 10 k
) must be placed on
the two I2C bus lines.
C3= 10µF
Vdd
C4 = 100nF
GND
Vdd_IO
INT 1
Digital signal from/to signal controller. Signal levels are defined by proper selection of Vdd_IO
1
5
8
13
TOP VIEW
6
9
14
16
9
5
INT 2
C1= 4.7µF
C2=0.22µF
AM12678V1



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