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STM32F100RC 数据表(PDF) 93 Page - STMicroelectronics |
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STM32F100RC 数据表(HTML) 93 Page - STMicroelectronics |
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93 / 106 page  DocID15081 Rev 10 93/106 STM32F100xC, STM32F100xD, STM32F100xE Package characteristics 105 Figure 39. LQFP144 - 144-pin, 20 x 20 mm low-profile quad flat package recommended footprint 1. Dimensions are expressed in millimeters. Device marking for LQFP144 The following figure shows the device marking for the LQFP144 package. Figure 40.LQFP144 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. |
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