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MB96F348CWCPMC-GSE2 数据表(PDF) 102 Page - Cypress Semiconductor |
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MB96F348CWCPMC-GSE2 数据表(HTML) 102 Page - Cypress Semiconductor |
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102 / 109 page ![]() MB96340 Series Document Number: 002-04579 Rev. *A Page 102 of 109 17. Package Dimension MB96(F)34x QFP 100P 100-pin plastic QFP Lead pitch 0.65 mm Package width × package length 14.00 mm × 20.00 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 3.35 mm MAX Code (Reference) P-QFP100-14 ×20-0.65 100-pin plastic QFP (FPT-100P-M22) (FPT-100P-M22) C 2006-2008 FUJITSU MICROELECTRONICS LIMITED F100033S-c-1-2 1 30 31 50 51 80 81 100 20.00±0.20(.787±.008) 23.90±0.40(.941±.016) 14.00±0.20 (.551±.008) 17.90±0.40 (.705±.016) INDEX 0.65(.026) 0.32±0.05 (.013±.002) M 0.13(.005) "A" 0.17±0.06 (.007±.002) 0.10(.004) Details of "A" part (.035±.006) 0.88±0.15 (.031±.008) 0.80±0.20 0.25(.010) 3.00 +0.35 –0.20 +.014 –.008 .118 (Mounting height) 0.25±0.20 (.010±.008) (Stand off) 0~8° * * Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. |
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