ADM1266ACPZ-R7 datasheet(62/62 Pages) AD

62 / 62 page

ADM1266

Data Sheet

Rev. A | Page 62 of 62

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

7.70

7.60 SQ

7.50

0.45

0.40

0.35

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

0.30

0.25

0.18

9.10

9.00 SQ

8.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.20 MIN

7.50 REF

COMPLIANT TO JEDEC STANDARDS MO-220-WMMD

SIDE VIEW

EXPOSED

PAD

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

SEATING

PLANE

Figure 30. 64-Lead Lead Frame Chip Scale Package [LFCSP]

9 mm × 9 mm Body and 0.75 mm Package Height

(CP-64-15)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADM1266ACPZ

−40°C to +85°C

64-Lead Lead Frame Chip Scale Package [LFCSP]

CP-64-15

ADM1266ACPZ-R7

−40°C to +85°C

64-Lead Lead Frame Chip Scale Package [LFCSP]

CP-64-15

ADM1266-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

registered trademarks are the property of their respective owners.

D15579-0-8/18(A)

ADM1266ACPZ-R7 数据表(PDF) 62 Page - Analog Devices

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