MPC8343ECVRADDB datasheet(71/80 Pages) NXP

71 / 80 page

MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11

Freescale Semiconductor

Thermal

Accurate thermal design requires thermal modeling of the application environment using computational

fluid dynamics software which can model both the conduction cooling and the convection cooling of the

air moving through the application. Simplified thermal models of the packages can be assembled using the

junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More

detailed thermal models can be made available on request.

Heat sink vendors include the following list:

Aavid Thermalloy

603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Alpha Novatech

408-567-8082

473 Sapena Ct. #12

Santa Clara, CA 95054

Internet: www.alphanovatech.com

International Electronic Research Corporation (IERC)

818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Millennium Electronics (MEI)

408-436-8770

Loroco Sites

671 East Brokaw Road

San Jose, CA 95112

Internet: www.mei-thermal.com

Tyco Electronics

800-522-2800

Chip Coolers™

P.O. Box 3668

Harrisburg, PA 17105-3668

Internet: www.chipcoolers.com

Wakefield Engineering

603-635-5102

33 Bridge St.

Pelham, NH 03076

Internet: www.wakefield.com

MEI, 75

× 85 × 12 no adjacent board, extrusion

1 m/s

7.7

MEI, 75

× 85 × 12 no adjacent board, extrusion

2 m/s

6.6

MEI, 75

× 85 × 12 mm, adjacent board, 40 mm side bypass

1 m/s

6.9

Table 60. Heat Sink and Thermal Resistance of MPC8343EA (PBGA) (continued)

Heat Sink Assuming Thermal Grease

Air Flow

× 29 mm PBGA

Thermal Resistance

MPC8343ECVRADDB 数据表(PDF) 71 Page - NXP Semiconductors

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