STM32WLE4JC datasheet(137/146 Pages) STMICROELECTRONICS

部件名	STM32WLE4JC

功能描述	Multiprotocol LPWAN 32-bit Arm® Cortex®-M4 MCUs, LoRa®, (G)FSK, (G)MSK, BPSK, up to 256KB Flash, 64KB SRAM

PDF	146 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

137 / 146 page

DS13105 Rev 9

137/146

STM32WLE5/E4xx

Package information

140

6.2

WLCSP59 package information

For more information on this package, contact the local STMicroelectronics sales office.

6.3

UFBGA73 package information

This UFBGA is a 73 balls, 5 × 5 mm, ultra thin fine pitch ball grid array package.

Figure 33. UFBGA73 - Outline

1. Drawing is not to scale.

2. - The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metalized

markings, or other feature of package body or integral heat slug.

- A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1

corner. Exact shape of each corner is optional.

Table 96. UFBGA73 - Mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

A(2)

0.60

0.236

0.11

0.0043

SEATING PLANE

ddd

B08E_UFBGA73_ME_V1

23 4

567

A1 INDEX CORNER AREA

b (73 BALLS)

eee

f f f M

A B

BOTTOM VIEW

SIDE VIEW

STM32WLE4JC 数据表(PDF) 137 Page - STMicroelectronics

STM32WLE4JC 数据表(HTML) 137 Page - STMicroelectronics

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