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STM32WLE4JC 数据表(PDF) 139 Page - STMicroelectronics

部件名 STM32WLE4JC
功能描述  Multiprotocol LPWAN 32-bit Arm® Cortex®-M4 MCUs, LoRa®, (G)FSK, (G)MSK, BPSK, up to 256KB Flash, 64KB SRAM
PDF  146 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32WLE4JC 数据表(HTML) 139 Page - STMicroelectronics

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DS13105 Rev 9
139/146
STM32WLE5/E4xx
Package information
140
Device marking for UFBGA73
The following figure gives an example of topside marking versus pin 1 position identifier
location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks, which depend on supply chain operations, are
not indicated below.
Figure 35. UFBGA73 marking example (package top view)
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not approved for use in production. ST is not responsible for any consequences
resulting from such use. In no event will ST be liable for the customer using any of these engineering
samples in production. ST’s Quality department must be contacted prior to any decision to use these
engineering samples to run a qualification activity.
Table 97. UFBGA recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5 mm
Dpad
0.230 mm
Dsm
0.330 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Pad trace width
0.100 mm
Ball diameter
0.280 mm
MSv64357V1
Date code
Product identification
(1)
Y WW
WLE5J8I6
Revision code
R
Pin 1 identifier



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