EFP01 datasheet(37/158 Pages) SILABS

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5.1.1 Absolute Maximum Ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of

the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure

to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-

bility data, see the Quality and Reliability Monitor Report at https://www.silabs.com/about-us/corporate-responsibility/commitment-to-

quality.

Table 5.1. Absolute Maximum Ratings

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Storage temperature range

TSTG

-50

—

150

°C

DC voltage on input supply

pins VDDA1

VVDDA

-0.3

—

2.0

DC voltage on input supply

pins VDDB1

VVDDB_DC

-0.3

—

5.5

Transient voltage on input

supply pin VDDB1

VVDDB_TRN

t < 30 µs, duty cycle < 0.01%

—

6.5

DC voltage connected

through inductor to LA2 pin

in boost configurations.1

VVBOOST

-0.3

—

5.5

Voltage on output supply

pins: VOA, VOB, VOC,

VOA_SW

VOUT

-0.3

—

5.5

DC voltage on VIO supply

VVIO

-0.3

—

5.5

DC voltage on any I/O pin

VDIGPIN

-0.3

—

VVIO+0.3

On-chip power dissipation2

PDIS

2-layer PCB, THETAJA = 81.2

°C/W, TAMBIENT = 25 °C

—

923

4-layer PCB, THETAJA = 66.0

°C/W, TAMBIENT = 25 °C

—

1136

Operating Junction tempera-

ture

-G grade devices

-40

—

105

°C

Note:

1. Note that there is no reverse battery insertion protection implemented on-chip. Applications that may be susceptible to a reverse

battery insertion should incorporate external protection circuitry.

2. Max on-chip power dissipation is given by: PMAX = (100 °C - TAMBIENT) / THETAJA

EFP01 Energy Friendly PMIC Family Data Sheet

Electrical Specifications

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