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EFP01 数据表(PDF) 38 Page - Silicon Laboratories |
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EFP01 数据表(HTML) 38 Page - Silicon Laboratories |
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38 / 158 page ![]() 5.1.2 Thermal Characteristics Table 5.2. Thermal Characteristic Parameter Symbol Test Condition Min Typ Max Unit Thermal impedance, junc- tion-to-ambient QFN20 (3x3mm) THETAJA 2 layer PCB, Natural Convection1 — 81.2 — °C/W 4 layer PCB, Natural Convection1 — 66.0 — °C/W Thermal impedance, junc- tion-to-board QFN20 (3x3mm) THETAJB 2 layer PCB, Natural Convection1 — 37.9 — °C/W 4 layer PCB, Natural Convection1 — 27 — °C/W Thermal impedance, junc- tion-to-case QFN20 (3x3mm) THETAJC 2 layer PCB, Natural Convection1 — 46.5 — °C/W 4 layer PCB, Natural Convection1 — 34.6 — °C/W Junction-to-top thermal char- acterization parameter QFN20 (3x3mm) PSIJT 2 layer PCB, Natural Convection1 — 2.6 — °C/W 4 layer PCB, Natural Convection1 — 1.9 — °C/W Junction-to-bottom thermal characterization parameter QFN20 (3x3mm) PSIJB 2 layer PCB, Natural Convection1 — 39.1 — °C/W 4 layer PCB, Natural Convection1 — 26.7 — °C/W Note: 1. Measured according to JEDEC standard JESD51-2A Integrated Circuit Thermal Test Method Environmental Conditions - Natural Convection (Still Air). EFP01 Energy Friendly PMIC Family Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.3 | 38 |
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