R5F104FCAFP datasheet(1/207 Pages) RENESAS

部件名	R5F104FCAFP

功能描述	True low-power platform (66 μA/MHz, and 0.57 μA for operation with only RTC and LVD) for the general-purpose applications, with 1.6-V to 5.5-V operation, 16- to 512-Kbyte code flash memory, and 41 DMIPS at 32 MHz

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制造商	RENESAS [Renesas Technology Corp]

网页	http://www.renesas.com

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Datasheet

RL78/G13

RENESAS MCU

True low-power platform (66

μA/MHz, and 0.57 μA for operation with only RTC and LVD) for the general-purpose

applications, with 1.6-V to 5.5-V operation, 16- to 512-Kbyte code flash memory, and 41 DMIPS at 32 MHz

R01DS0131EJ0350 Rev.3.50

1 of 200

Jun 30, 2020

R01DS0131EJ0350

Rev.3.50

Jun 30, 2020

1. OUTLINE

1.1 Features

Ultra-low power consumption technology

 VDD = single power supply voltage of 1.6 to 5.5 V

 HALT mode

 STOP mode

 SNOOZE mode

RL78 CPU core

 CISC architecture with 3-stage pipeline

 Minimum instruction execution time: Can be changed

from high speed (0.03125

μs: @ 32 MHz operation

with high-speed on-chip oscillator) to ultra-low speed

(30.5

μs: @ 32.768 kHz operation with subsystem

clock)

 Address space: 1 MB

 General-purpose registers: (8-bit register × 8) × 4

banks

 On-chip RAM: 2 to 32 KB

Code flash memory

 Code flash memory: 16 to 512 KB

 Block size: 1 KB

 Prohibition of block erase and rewriting (security

function)

 On-chip debug function

 Self-programming (with boot swap function/flash shield

window function)

Data Flash Memory

 Data flash memory: 4 KB to 8 KB

 Back ground operation (BGO): Instructions can be

executed from the program memory while rewriting the

data flash memory.

 Number of rewrites: 1,000,000 times (TYP.)

 Voltage of rewrites: VDD = 1.8 to 5.5 V

High-speed on-chip oscillator

 Select from 32 MHz, 24 MHz, 16 MHz, 12 MHz, 8 MHz,

6 MHz, 4 MHz, 3 MHz, 2 MHz, and 1 MHz

 High accuracy: +/- 1.0 % (VDD = 1.8 to 5.5 V, TA = -20

to +85°C)

Operating ambient temperature

 TA = -40 to +85°C (A: Consumer applications, D:

Industrial applications )

 TA = -40 to +105°C (G: Industrial applications)

Power management and reset function

 On-chip power-on-reset (POR) circuit

 On-chip voltage detector (LVD) (Select interrupt and

reset from 14 levels)

DMA (Direct Memory Access) controller

 2/4 channels

 Number of clocks during transfer between 8/16-bit

SFR and internal RAM: 2 clocks

Multiplier and divider/multiply-accumulator

 16 bits × 16 bits = 32 bits (Unsigned or signed)

 32 bits ÷ 32 bits = 32 bits (Unsigned)

 16 bits × 16 bits + 32 bits = 32 bits (Unsigned or

signed)

Serial interface

 CSI: 2 to 8 channels

 UART/UART (LIN-bus supported):2 to 4 channels

 I2C/Simplified I2C communication: 3 to 10 channels

Timer

 16-bit timer: 8 to 16 channels

 12-bit interval timer: 1 channel

 Real-time clock:

1 channel (calendar for 99 years,

alarm function, and clock

correction function)

 Watchdog timer:

1 channel (operable with the

dedicated low-speed on-chip

oscillator)

A/D converter

 8/10-bit resolution A/D converter (VDD = 1.6 to 5.5 V)

 Analog input: 6 to 26 channels

 Internal reference voltage (1.45 V) and temperature

sensor Note 1

I/O port

 I/O port: 16 to 120 (N-ch open drain I/O [withstand

voltage of 6 V]: 0 to 4, N-ch open drain I/O

[VDD withstand voltage Note 2/EVDD withstand

voltage Note 3]: 5 to 25)

 Can be set to N-ch open drain, TTL input buffer, and

on-chip pull-up resistor

 Different potential interface: Can connect to a 1.8/2.5/3

V device

 On-chip key interrupt function

 On-chip clock output/buzzer output controller

Others

 On-chip BCD (binary-coded decimal) correction circuit

Notes 1. Can be selected only in HS (high-speed main)

mode

2. Products with 20 to 52 pins

3. Products with 64 to 128 pins

Remark The functions mounted depend on the product.

See 1.6 Outline of Functions.

<R>

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