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ES9842PRO 数据表(PDF) 159 Page - ESS Technology,Inc |
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ES9842PRO 数据表(HTML) 159 Page - ESS Technology,Inc |
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159 / 167 page  VERSION 0.5 ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 WWW.ESSTECH.COM ES9842 PRO Product Datasheet 159 RPC-2 Pb-Free Process – Classification Temperatures (Tc) Package Thickness Volume mm3, <350 Volume mm3, 350 to 2000 Volume mm3, >2000 <1.6 mm 260°C 260°C 260°C 1.6 mm – 2.5 mm 260°C 250°C 245°C >2.5 mm 250°C 245°C 245°C Table 34 - RPC-2 Pb-Free Process At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the values specified in Table RPC-2. The use of a higher Tp does not change the classification temperature (Tc). Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks. The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. |
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