MPC5553_07 datasheet(6/66 Pages) FREESCALE

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MPC5553 Microcontroller Data Sheet, Rev. 2.0

Electrical Characteristics

Freescale Semiconductor

3.2

Thermal Characteristics

The shaded rows in the following table indicate information specific to a four-layer device.

3.2.1

General Notes for Specifications at Maximum Junction Temperature

An estimation of the device junction temperature, T

J, can be obtained from the equation:

TJ = TA + (RθJA × PD)

where:

TA = ambient temperature for the package (oC)

RθJA = junction to ambient thermal resistance (oC/W)

PD = power dissipation in the package (W)

The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide

consistent values for estimations and comparisons. The difference between the values determined for the

single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground

plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance

depends on the:

Table 3. Thermal Characteristics

Spec

MPC5553 Thermal Characteristic

Symbol

Package

Unit

208

MAPBGA

324

PBGA

416

PBGA

Junction to ambient 1, 2, natural convection (one-layer board)

1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

RθJA

°C/W

Junction to ambient 1, 3, natural convection

(four-layer board 2s2p)

3 Per JEDEC JESD51-6 with the board horizontal.

RθJA

°C/W

Junction to ambient (@200 ft./min., one-layer board)

RθJMA

°C/W

Junction to ambient (@200 ft./min., four-layer board 2s2p)

RθJMA

°C/W

Junction to board 4 (four-layer board 2s2p)

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

RθJB

°C/W

Junction to case 5

5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method

(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.

RθJC

°C/W

Junction to package top 6, natural convection

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2.

°C/W

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