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MPC5553 数据表(PDF) 17 Page - Freescale Semiconductor, Inc |
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MPC5553 数据表(HTML) 17 Page - Freescale Semiconductor, Inc |
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17 / 66 page ![]() Electrical Characteristics MPC5553 Microcontroller Data Sheet, Rev. 2.0 Freescale Semiconductor 17 Figure 3 shows an approximate interpolation of the ISTBY worst-case specification to help estimate the values at different voltages and temperatures. The vertical lines inside the graph show the actual specifications listed in Table 9. Refer to the IDDSTBY specifications (27d) in Table 9 for more information. Figure 3. ISTBY Worst-case Specifications 3.8.1 I/O Pad Current Specifications The power consumption of an I/O segment depends on the usage of the pins on a particular segment. The power consumption is the sum of all output pin currents for a particular segment. The output pin current can be calculated from Table 10 based on the voltage, frequency, and load on the pin. Use linear scaling to calculate pin currents for voltage, frequency, and load parameters that fall outside the values given in Table 10. 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 0.8V 1.0V 1.2V ISTBY Related to Junction Temperature Temperature (C) |
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