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MCP8021 数据表(PDF) 50 Page - Microchip Technology |
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MCP8021 数据表(HTML) 50 Page - Microchip Technology |
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50 / 66 page ![]() MCP8021/2 DS20006265D-page 50 2020-2024 Microchip Technology Inc. and its subsidiaries REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: SECTION A-A A4 E3 ROTATED 180° Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b E2 A3 e L E N 0.50 BSC 0.203 REF 0.35 0.20 0.80 0.00 0.25 0.40 0.85 0.02 5.00 BSC MILLIMETERS MIN NOM 28 0.45 0.30 0.90 0.05 MAX K- 0.20 - Terminal-to-Exposed-Pad Overall Length Exposed Pad Length D D2 3.15 5.00 BSC 3.25 3.35 3.15 3.25 3.35 Exposed Pad Chamfer CH 0.35 REF Microchip Technology Drawing C04-426 Rev D Sheet 2 of 2 28-Lead Very Thin Plastic Quad Flat, No Lead Package (9PX) - 5x5 mm Body [VQFN] With Stepped Wettable Flanks, 3.25x3.25mm Exposed Pad Wettable Flank Height A4 – Wettable Flank Width E3 – – 0.085 0.10 0.19 |
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