MCP8021 datasheet(53/66 Pages) MICROCHIP

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 2020-2024 Microchip Technology Inc. and its subsidiaries

DS20006265D-page 53

MCP8021/2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

DETAIL A

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Molded Package Width

Molded Package Thickness

Pitch

Standoff

Units

Dimension Limits

0.65 BSC

0.90

0.50

0.19

0.05

0.60

MILLIMETERS

MIN

NOM

0.70

0.30

1.10

0.15

MAX

1.00 REF

Footprint

Overall Length

9.70 BSC

Terminal Thickness

0.09

0.20

0.09

Lead Bend Radius

0.09

Lead Bend Radius

0°

8°

Foot Angle

14°

Mold Draft Angle

0.85

0.95

14°

Mold Draft Angle

6.40 BSC

4.40 BSC

(L1)

28-Lead Shrink Smal Outline Package (KEX) - 4.4 mm (.300 In.) Body [TSSOP]

With 3.1x4.6 mm Exposed Pad

Microchip Technology Drawing C04-521 Rev A

Exposed Pad Length

4.50

4.60

4.70

Exposed Pad Width

3.00

3.10

3.20

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