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MCP8021 数据表(PDF) 51 Page - Microchip Technology |
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MCP8021 数据表(HTML) 51 Page - Microchip Technology |
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51 / 66 page  2020-2024 Microchip Technology Inc. and its subsidiaries DS20006265D-page 51 MCP8021/2 RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 3.35 3.35 MILLIMETERS 0.50 BSC MIN E MAX 4.90 Contact Pad Length (X28) Contact Pad Width (X28) Y1 X1 0.85 0.30 Microchip Technology Drawing C04-2426 Rev D NOM C1 Contact Pad Spacing 4.90 Contact Pad to Center Pad (X28) G1 0.35 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C1 C2 EV EV X2 E X1 ØV G1 Y1 SILK SCREEN Contact Pad to Contact Pad (X24) G2 0.20 28-Lead Very Thin Plastic Quad Flat, No Lead Package (9PX) - 5x5 mm Body [VQFN] With Stepped Wettable Flanks, 3.25x3.25mm Exposed Pad 1 2 28 Y2 0.20 |
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