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MCP8021 数据表(PDF) 59 Page - Microchip Technology |
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MCP8021 数据表(HTML) 59 Page - Microchip Technology |
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59 / 66 page ![]() 2020-2024 Microchip Technology Inc. and its subsidiaries DS20006265D-page 59 MCP8021/2 Microchip Technology Drawing C04-424A Sheet 2 of 2 Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b E2 A2 e L E N 0.50 BSC 3.10 0.50 0.17 - 0.05 - 0.60 3.20 - - 6.40 BSC MILLIMETERS MIN NOM 38 3.30 0.70 0.27 1.10 0.15 MAX 14° REF REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensioning and tolerancing per ASME Y14.5M Mold Draft Angle 38-Lead Thin Shrink Small Outline Package (SBX) - 4.4 mm Body [TSSOP] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: With 4.6x 3.2 mm Exposed Pad Overall Length Exposed Pad Length D D1 4.50 4.60 4.70 L (L1) 1° ( °) ( °) S R1 R DETAIL A Molded Package Width E1 4.40 0.85 0.90 0.95 9.60 9.70 9.80 4.30 4.60 Terminal Width c 0.09 - 0.20 Terminal Foot Angle 0° - 8° S0.20 - - Lead Shoulder Terminal Length L1 1.00 REF 1 |
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