SAP5SD-B-G1-R datasheet(8/67 Pages) RENESAS

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SAP51 / SAP5S Datasheet

January 28, 2016

General Device Specification

Important note: The absolute maximum ratings given in section 2.1 are stress ratings only. The SAP5 might not

function or be operable above the recommended operating conditions given in section 2.2. Stresses exceeding

the absolute maximum ratings might also damage the device. In addition, extended exposure to stresses above

the recommended operating conditions might affect device reliability. IDT does not recommend designing to the

specifications given under “Absolute Maximum Ratings.”

Important note: The operating conditions given in section 2.2 set the conditions over which IDT specifies device

operation. These are the conditions that the application circuit should provide to the device for it to function as

intended. Unless otherwise noted, the limits for parameters that appear in the operating conditions section are

used as test conditions.

2.1.

Absolute Maximum Ratings (Non-operating)

Table 2.1

Absolute Maximum Ratings

PARAMETER

SYMBOL

MIN

MAX

UNIT

Voltage reference

VLTGN

Voltage difference

1) between LTGP and LTGN pins (V

LTGP - VLTGN)

VLTGP-LTGN

Pulse voltage

2), 3) between LTGP and LTGN (V

LTGP - VLTGN)

VLTGP-LTGN_P

Voltage at the CDC, D0, D1, D2, D3, P0, P1, P2, P3, DSTBn,

PSTBn, LED1, LED2, PFAULT, and UOUT pins

Vinputs1

-0.3

VUOUT+ 0.3

Voltage at the OSC1, OSC2, U5R pins

Vinputs2

-0.3

Input current into any pin except supply pins

Iin

-50

Humidity – non-condensing

Electrostatic discharge

6) – Human Body Model (HBM2)

VHBM

1500

Electrostatic discharge

7) – Equipment Discharge Model (EDM)

VEDM

200

Storage temperature

TSTG

-55

125

°C

Soldering temperature Sn/Pb

Tlead

240

°C

Soldering temperature 100%Sn

Tlead

260

°C

Thermal resistance of SOP 16 package

Rthj-16

100

K/W

Thermal resistance of SOP 20 package

Rthj-20

K/W

Reverse polarity protection must be performed externally.

VLTGP-LTGN and VLTGP-LTGN_P must not be violated.

Pulse with

≤ 50µs, repetition rate ≤ 0.5 Hz.

Latch-up resistance, reference pin is 0V.

Level 4 according to JEDEC-020D is guaranteed.

HBM: C = 100pF charged to VHBM2 with resistor R = 1.5k

Ω in series, valid for all pins except LTGP-LTGN.

EDM: C = 200pF charged to VEDM with no resistor in series, valid for LTGP-LTGN only.

Soldering must comply with the JEDEC-J-STD-020D standard.

Single layer board, Ptot = 0.5W; air velocity = 0m/s ⇒ max. value; air velocity = 2.5m/s ⇒ min. value.

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