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MPC5633MMLL60 数据表(PDF) 68 Page - Freescale Semiconductor, Inc |
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MPC5633MMLL60 数据表(HTML) 68 Page - Freescale Semiconductor, Inc |
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68 / 106 page  MPC5634M Microcontroller Data Sheet, Rev. 8 Freescale Semiconductor 68 Table 10. Thermal characteristics for 176-pin LQFP1 1 Thermal characteristics are targets based on simulation that are subject to change per device characterization. Symbol C Parameter Conditions Value Unit RJA CC D Junction-to-Ambient, Natural Convection2 2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets JEDEC specification for this package. Single layer board - 1s 38 °C/W RJA CC D Junction-to-Ambient, Natural Convection2 Four layer board - 2s2p 31 °C/W RJMA CC D Junction-to-Moving-Air, Ambient2 @200 ft./min., single layer board - 1s 30 °C/W RJMA CC D Junction-to-Moving-Air, Ambient2 @200 ft./min., four layer board - 2s2p 25 °C/W RJB CC D Junction-to-Board3 3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for the specified package. 20 °C/W RJCtop CC D Junction-to-Case4 4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer. 5°C/W JT CC D Junction-to-Package Top, Natural Convection5 5 Thermal characterization parameter indicating the temperature difference between the package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. 2°C/W Table 11. Thermal characteristics for 208-pin MAPBGA1 1 Thermal characteristics are targets based on simulation that are subject to change per device characterization. Symbol C Parameter Conditions Value Unit RJA CC D Junction-to-ambient, natural convection2,3 2 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 3 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal. One layer board - 1s 39 °C/W RJMA CC D Junction-to-ambient natural convection2,4 4 Per JEDEC JESD51-6 with the board horizontal. Four layer board - 2s2p 24 °C/W RJA CC D Junction-to-ambient (@200 ft/min)2,4 Single layer board 31 °C/W RJMA CC D Junction-to-ambient (@200 ft/min)2,4 Four layer board 2s2p 20 °C/W RJB CC D Junction-to-board5 5 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. Four layer board - 2s2p 13 °C/W RJC CC D Junction-to-case6 6 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. 6°C/W JT CC D Junction-to-package top natural convection7 2°C/W |
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