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MPC8313VRGDDB 数据表(PDF) 64 Page - Freescale Semiconductor, Inc |
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MPC8313VRGDDB 数据表(HTML) 64 Page - Freescale Semiconductor, Inc |
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64 / 100 page ![]() MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2.1 64 Freescale Semiconductor Package and Pin Listings 19.2 Mechanical Dimensions of the MPC8313E TEPBGAII Figure 56 shows the mechanical dimensions and bottom surface nomenclature of the 516-TEPBGAII package. Figure 56. Mechanical Dimension and Bottom Surface Nomenclature of the MPC8313E TEPBGAII Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Package code 5368 is to account for PGE and the built-in heat spreader. |
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