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KM416RD8ACD-RK80 数据表(PDF) 61 Page - Samsung semiconductor

部件名 KM416RD8ACD-RK80
功能描述  128/144Mbit RDRAM 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
PDF  64 Pages
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制造商  SAMSUNG [Samsung semiconductor]
网页  http://www.samsung.com/Products/Semiconductor
标志 SAMSUNG - Samsung semiconductor

KM416RD8ACD-RK80 数据表(HTML) 61 Page - Samsung semiconductor

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Page 58
KM416RD8AC(D)/KM418RD8AC(D)
Direct RDRAM™
Rev. 1.01 Oct. 1999
Center-Bonded uBGA Package
Figure 61 shows the form and dimensions of the recom-
mended package for the center-bonded CSP device class.
Figure 61: Center-Bonded uBGA Package
Table 27 lists the numerical values corresponding to dimen-
sions shown in Figure 61.
Table 27: Center-Bonded uBGA Package Dimensions
A
B
C
D
E
F
G
H
J
1
2
3
4
5
6
7
D
A
e1
d
E
E1
8
e2
Top
Bottom
Top
Bottom
9
10
11
12
Symbol
Parameter
Min(128Mb/144Mb)
Max(128Mb/144Mb)
Unit
e1
Ball pitch (x-axis)
1.00
1.00
mm
e2
Ball pitch (y-axis)
0.80
0.80
mm
A
Package body length
11.90
12.10
mm
D
Package body width
10.10
10.30
mm
E
Package total thickness
-
1.00a
mm
E1
Ball height
0.20
0.30
mm
d
Ball diameter
0.30
0.40
mm
a. The E,MAX parameter for SO-RIMM applications is 0.94mm.



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