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WM8904ECS/R 数据表(PDF) 185 Page - Wolfson Microelectronics plc |
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WM8904ECS/R 数据表(HTML) 185 Page - Wolfson Microelectronics plc |
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185 / 188 page ![]() Pre-Production WM8904 w PP, Rev 3.3, September 2012 185 PACKAGE DIMENSIONS The 36-ball W-CSP package drawing is shown below. B: 36 BALL W-CSP PACKAGE 2.651 X 2.525 X 0.698mm BODY, 0.40 mm BALL PITCH A1 CORNER TOP VIEW E A aaa 2 X D 5 4 DETAIL 2 DETAIL 2 A A2 2 B aaa 2 X A1 Z bbb Z 1 E1 A D1 DETAIL 1 D C B F E e e BOTTOM VIEW 1 65 43 2 g NOTES: 1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING. 3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE. 4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH. 6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE. 7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C. A1 0.177 D D1 E E1 e 2.000 BSC 2.525 0.313 2.000 BSC 0.400 BSC 2.651 Dimensions (mm) Symbols MIN NOM MAX NOTE A 0.698 A2 0.452 0.468 0.484 5 f1 0.733 0.663 0.208 0.239 g 0.022 h 0.258 f2 0.250 f1 f2 h DM066.C 2.626 2.676 2.500 2.550 0.218 0.298 4 A B Z ddd M A B Z ccc aaa bbb ccc ddd 0.025 0.060 0.030 0.015 DETAIL 1 |
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