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STM32F217VG 数据表(PDF) 155 Page - STMicroelectronics |
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STM32F217VG 数据表(HTML) 155 Page - STMicroelectronics |
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155 / 175 page ![]() DocID17050 Rev 9 155/175 STM32F21xxx Package characteristics 174 Figure 79. Recommended footprint 1. Drawing is not to scale. 2. Dimensions are in millimeters. E1 19.800 20.000 20.200 0.7795 0.7874 0.7953 E3 - 17.500 - - 0.6890 - e - 0.500 - - 0.0197 - L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - k 0° 3.5°7° 0°3.5° 7° ccc - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 88. LQFP144 20 x 20 mm, 144-pin low-profile quad flat package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max ai14905c 0.5 0.35 19.9 17.85 22.6 1.35 22.6 19.9 1 36 37 72 73 108 109 144 |
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