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STM32F217VG 数据表(PDF) 151 Page - STMicroelectronics |
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STM32F217VG 数据表(HTML) 151 Page - STMicroelectronics |
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151 / 175 page ![]() DocID17050 Rev 9 151/175 STM32F21xxx Package characteristics 174 Figure 75. Recommended footprint 1. Drawing is not to scale. 2. Dimensions are in millimeters. E 11.800 12.000 12.200 0.4646 0.4724 0.4803 E1 9.800 10.000 10.200 0.3937 0.3937 0.4016 E3 - 7.500 - - 0.2953 - e - 0.500 - - 0.0197 - K 0° 3.5°7° 0°3.5° 7° L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - ccc - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 86. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max 48 32 49 64 17 1 16 1.2 0.3 33 10.3 12.7 10.3 0.5 7.8 12.7 ai14909c |
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