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AS3953 数据表(PDF) 39 Page - ams AG |
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AS3953 数据表(HTML) 39 Page - ams AG |
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39 / 42 page ![]() www.ams.com Revision 1.0 39 - 42 AS3953 Datasheet - P ac k a ge D ra w i n gs a nd M a r ki n gs Figure 17. Gold Bumped Dies 11-pins Table 12. Specification for Gold Bumps Item Min Max Unit Backgrinded Wafer Height (excl bimp height) 100 µm Bump Height 13 17 µm Height Coplanarity for within Wafer < 4 µm Height Coplanarity for within Die < 2 µm Surface roughness <= 3 µm Hardness 35 65 Hv Shear Force 8 >= mg/µm 2 |
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